Electronics R&D, Manufacturing, and Packaging
NEPCON JAPAN is a trade show for electronics R&D, manufacturing, and packaging technology. The 2026 edition was its 40th, organized by RX Japan.
From Basic Connections to Smart Terminals
YenProtek Exhibits in Tokyo with the NEXUSLINK Technology Alliance
YenProtek took part in NEPCON JAPAN 2026 at Tokyo Big Sight in Japan, co-exhibiting with NEXUSLINK Technology Alliance partners How Der Electronic and New Cheng Technology to showcase integrated applications ranging from electronic connectors to AIoT smart terminal devices.
Exhibition Recap
This time, we co-exhibited with NEXUSLINK Technology Alliance partners How Der Electronic and New Cheng Technology under the theme "From Basic Connections to Smart Terminals," showcasing integrated applications from electronic connectors to AIoT smart terminal devices and demonstrating Taiwan's strengths in electronics integration and smart terminal solutions.
During the show, YenProtek also exchanged ideas with a number of Japanese companies and international industry partners, sharing experience in applying AIoT to smart manufacturing and industrial digital transformation. This laid a solid foundation for future cross-industry cooperation and technology integration as we continue to take smart manufacturing and AIoT solutions global.
About the Show
NEPCON JAPAN is a trade show for electronics R&D, manufacturing, and packaging technology. The 2026 edition was its 40th, organized by RX Japan.
Held concurrently with AUTOMOTIVE WORLD, Factory Innovation Week, and Smart Logistics Expo.
YenProtek co-exhibited with How Der Electronic and New Cheng Technology, linking applications all the way from electronic connectors to smart terminals.
From sensing and connectivity to platform integration, we would be glad to discuss working together.